Student Exchange : TSSP Tohoku University Science Summer Program

TSSP Tohoku University Science Summer Program, Summer 2016
July 4th to July 15th, 2016
About the Program:
TSSP is designed for undergraduates majoring science and engineering. It aims to provide students with insight on what world society needs based on advanced science and technology in the future and how they can contribute to society. Program participants will have an opportunity to experience lectures with facility/laboratory visits followed by a final presentation based on group work. Topics covered in this program are:  Spintronics – Computer Vision in Robotics – Robotics – Neutrinos – Carbon Nanotube – Modern
Physical Chemistry – The 2011 Tohoku Earthquake and more. (Topics are subject to change.)

Eligibility :

  • Full-time undergraduate students of IPB.  Students must be enrolled in their home university during this program
  • Sufficient English Ability (Equivalent to TOEFL iBT 70 or PBT 520)

Application procedures :

  • submit all application documents in a clear-green folder to DITMAWA by 14 March 2016
  • interview session will be announced between 21-24 March 2016 (based on further announcement)
  • application documents will be submitted to Tohoku University collectively by IPB

Documents required :

  1. Applicant’s portrait photo (4 cm x 3 cm)
  2. Transcript from the previous academic year in English – can be obtained at Dit.AP
  3. Photocopy of passport (page with applicant’s photo)
  4. Personal Statement (300-500 words/reasons for applying)
  5. Copy of English language ability certificate and scores
  6. Application Form for Japan Student Services Organization (JASSO) Scholarship with hand-written signature (if applicable)
More information can be downloaded in the following link:

Please contact for further inquiries in the following format:
TSSP-2016-Name-Student ID-Major-Inquiry

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